Products
Gold Conductor Pastes
| Product | Purpose | Order Trial Quantity |
|
|---|---|---|---|
| 8081-C |
Thin-printing metallo-organic gold |  |
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| 8813-G | For use on aluminum nitride (AlN), can be used for 25 and 50 µm gold wire bonding | |
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| 8831-UF | Pure gold for use over other conductors or dielectrics, or in LTCC tape | |
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| 8835 VF-G | Multilayer Via Fill | |
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| 8837-G | Very thin printing (1-2 µm), wire bondable | |
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| 8844-G | General purpose for use on alumina and 4920 dielectric, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding | |
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| 8846-G | General purpose, alloyed, for aluminum wire bonding use on alumina and 4920, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding | |
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| 8847 | For printing on alumina, excellent line definition, surface smoothness, printability, and gold wire bonding properties | |
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| 8880-G | Excellent wire bonding and conductivity, fritless, 980 °C firing | |
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| 8884-G | Excellent wire bonding and conductivity, fritless, 850 °C firing | |
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| 8886 | Etchable, thin fired film (1 µm), for use on glazed ceramics | |
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| 803 | For use in LTCC systems | |
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| 8081-A | Metallo-organic, <1 µm fired thickness on alumina | |
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| 8835 (520C) | 520 °C firing on glass and ceramic substrates | |
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| 8835-1A | Alloyed gold for both Au and Al wire bonding | |
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| 8835-1B | General purpose, high adhesion, excellent line definition, for Au wire bonding up to 33 µm | |
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| 8835-1D | General purpose for use on aluminum nitride | |
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| 8836 | Thinner printing version of 8835-1B | |
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| 8836-F | Shorter firing cycle version of 8836 (13 minutes) | |
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| 8838-VF | Hole plug fill | |
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| 8844 | General purpose, Cd-free, fritless, 850 °C firing | |
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| 8880 | Low resistivity <3 mohm/sq., etchable, microwave applications, 980 °C firing, fritless, for general use, including use in fuel cells | |
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| 8881-B | Etchable, fritless, 850 °C firing, thin printing (6-8 µm), dense film for 25 µm Au wire bonding | |
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| 8881-BA | Etchable, fritless, 850 °C firing, thin printing (6-8 µm), alloyed Au for 25 µm Al wire bonding | |
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| 8884 | Fritless, 850 °C firing, for power applications on alumina or beryllia | |
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| 8884-A | Fritless, 850 °C firing, alloyed gold, for power applications on alumina or beryllia, 250 µm Al wire bonding | |
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Green Products are Lead-Free, Cadmium-Free
The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)
The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)